We are aiming for optimum design from prototype design and design plan of product that customer desires to package prototype process such as Package Lay-out step and master section verification through structural improvement and 3D solid modeling implementation and simulation to correspond to prototype product and cope with mass product.

We are conducting research and development through the latest equipment from design stage to mold making. We are doing design verification using 3D design and various simulation tools to fully respond to customer's needs systematically. Based on the technology accumulated through the development of semiconductor peripheral equipments, we are constantly developing our technology, investing boldly, and continuously improving our business. We are training development personnel. The research institute is called 'Company's Tomorrow' Researchers are concentrating their efforts on making the best technology research institute in the world with the best efforts.